Electro-optical apparatus, manufacturing method thereof, and electronic instrument

ABSTRACT

The invention achieves a reduction in a thickness while suppressing a thermal effect. An apparatus includes a light-emitting element and a sealing layer to hermetically seal the light-emitting element. The sealing layer includes a heat radiation layer having thermal conductivity.

This is a Continuation of application Ser. No. 10/285,542 filed Nov. 1,2002. The entire disclosure of the prior application is herebyincorporated by reference herein in its entirety.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to an electro-optical apparatus, amanufacturing method thereof, and an electronic instrument having theelectro-optical apparatus. More specifically, the invention relates toan electro-optical apparatus having a light-emitting element, such as anorganic EL apparatus, a manufacturing method thereof, and an electronicinstrument having the electro-optical apparatus.

2. Description of Related Art

A related art electro-optical apparatus, such as a liquid crystalapparatus and an organic EL (electroluminescence) apparatus, may have aplurality of circuit elements, electrodes, liquid crystal elements, orEL elements deposited on a substrate. For example, the organic ELapparatus has a light-emitting element containing a light-emittingsubstance, and being sandwiched by electrode layers formed of an anodeand a cathode, so that it utilizes a light-emitting phenomena ofpositive holes injected from the anode side and electrons injected fromthe cathode side, which are rejoined together in a light-emittablelight-emitting layer so as to be inactivated from an excited state.

SUMMARY OF THE INVENTION

Such a related art electro-optical apparatus mentioned above, however,has the following problems.

Since the organic EL apparatus having the above-mentioned structure hasa current-drive type light-emitting element, a current has to be fedbetween the anode and the cathode when light is emitted. As a result,the element generates heat when emitting light, and when oxygen andmoisture exist around the element, the oxidation of an element materialdue to the oxygen and moisture is promoted so as to degrade the element.An alkaline metal and alkaline earth metal used especially in thecathode are liable to be oxidized. A typical example of the elementdegradation due to the oxygen and water is a production of a dark spotand the development thereof. The dark spot means a defective luminousspot. When the degradation of the light-emitting element is acceleratedin connection with the driving of the organic EL apparatus, instabilitywith time, such as reducing luminance brightness and luminousinstability, and reduced duration of life, have occurred.

Exemplary structures to suppress the above-mentioned degradationinclude: the light-emitting element being sandwiched by a pair of glassplates using an adhesive so as to seal the element off the atmosphere,and a cooling device being provided to supply cooling fluid on eithersurface of the substrate, as disclosed in Japanese Unexamined PatentApplication Publication No. 2001-196165. In using the glass plate,however, the problem arises that the thickness of the apparatus isincreased since at least two glass plates are used. Also, in providingthe cooling device, the increase in size of the apparatus cannot beavoided because of the necessity of forming a flow path for the fluid.

The present invention addresses the problems mentioned above, andprovides an electro-optical apparatus capable of reducing or suppressinga thermal effect and also having a reduced thickness. The invention alsoprovides a manufacturing method thereof, and an electronic instrumentincluding the electro-optical apparatus.

In order to address or achieve the above, the present invention adoptsthe following exemplary arrangements.

An electro-optical apparatus according to the present invention includesa light-emitting element and a sealing layer to hermetically seal thelight-emitting element. The sealing layer includes a heat radiationlayer having thermal conductivity.

Therefore, in the electro-optical apparatus according to the presentinvention, by hermetically sealing the light-emitting element with thefilm-shaped sealing layer, the degradation thereof due to oxygen ormoisture can be reduced or suppressed without increasing the thickness.Even when heat is generated by the emitting light of the light-emittingelement, for example, because the heat can be radiated via the heatradiation layer, a material of the element can be reduced or suppressedagainst oxidation, enabling the degradation of the light-emittingelement to be furthermore reduced or prevented.

The heat radiation layer may be made of a metallic layer, such asfilm-shaped gold, silver, or copper. In this case, since the thermalconductivity in the gold, silver, and copper is large, the heat producedby light emitting of the light-emitting element can be effectivelyradiated according to the present invention. By reducing the thicknessof the heat radiation layer to 10 nm or less, for example, an excellentlight-transmissivity can be obtained especially in the gold and silver.Therefore, when the light produced by the light-emitting element isprojected via the sealing layer so as to derive the light from a commonelectrode, the light can be transmitted with small loss.

The heat radiation layer may also adopt an insulating film to protectthe transmission of an alkaline metal. The insulating film may be formedof a material including at least one element selected from B (boron), C(carbon), and N (nitrogen) and at least one element selected from Al(aluminum), Si (silicon), and P (phosphorus), and a material includingSi, Al, N, O, and M (where M is at least one kind of rare earthelements, and it is preferably at least one element selected from Ce(cerium), Yb (ytterbium), Sm (samarium), Er (erbium), Y (yttrium), La(lanthanum), Gd (gadolinium), Dy (dysprosium), and Nd (neodymium)). Inthis case, by arranging the insulating film in the vicinity of thelight-emitting element, the blocking effect against moisture and analkaline metal can be obtained, while the function of an insulating filmalso having a heat radiation effect can be obtained, enabling thedegradation of the light-emitting element to be suppressed.

Also, the present invention may be provided such that one of the gasbarrier layer made of an inorganic compound, and the heat radiationlayer made of an organic compound, is formed on the upper side of theinsulating layer.

Thereby, according to the present invention, by hermetically sealing thelight-emitting element with the gas barrier layer, the degradation dueto oxygen and moisture can be suppressed without increasing thethickness. Forming a planarized insulating layer also planarizes the gasbarrier layer or the heat radiation layer which is formed on the upperside of the insulating layer, preventing the reduction in barrier thatis otherwise degraded by strain due to unevenness.

The present invention may be provided such that the organic compoundconstituting the insulating layer is a polymer. For example, the polymeris made by curing or polymerizing monomers or precursors that werepreviously applied. Using monomers or precursors with low viscosityforms an excellently planarized polymer layer.

According to the present invention, a gas-permeable protection film maybe formed on the upper side of the sealing layer.

Thereby, according to the present invention, the scratching resistanceof the sealing layer, and by extension the scratching resistance of theelectro-optical apparatus, is enhanced, reducing or preventing damage tothe sealing layer and the light-emitting layer due to an externalimpact. Since the protection film is gas-permeable, the heat produced inthe sealing layer is liable to be radiated to the outside of theapparatus. The protection film may be formed on the entire surface ofthe substrate or may be patterned. In view of contaminant sticking,water absorption, moisture absorption, and impact resistance, theprotection film may preferably be a material with low surface-activeenergy, such as a fluorine polymer, silicone resin, polyolefine resin,and polycarbonate resin.

An electronic instrument according to the present invention includes theelectro-optical apparatus described above.

Thereby, according to the present invention, an electronic instrumentwith a long life span and thin thickness can be obtained, in which thedegradation of the light-emitting element is reduced or suppressed.

On the other hand, a manufacturing method of an electro-opticalapparatus according to the present invention, the electro-opticalapparatus having a light-emitting element, includes forming a sealinglayer to hermetically seal the light-emitting element. Forming thesealing layer includes forming a heat radiation layer having thermalconductivity.

Thereby, according to the manufacturing method of the present invention,by hermetically sealing the light-emitting element with the film-shapedsealing layer, the degradation due to oxygen and moisture can be reducedor suppressed without increasing the thickness. Also, even when heat isproduced by light emitting of the light-emitting element, for example,because the heat can be radiated via the heat radiating layer, theoxidation of a material of the element can be reduced or suppressed,further reducing or preventing the degradation of the light-emittingelement.

According to the present invention, forming the sealing layer mayinclude covering an insulating layer made of an organic compound on thelight-emitting element and forming one of a gas barrier layer made of aninorganic compound and the heat radiation layer on the insulating layer.

Thereby, according to the present invention, by hermetically sealing thelight-emitting element with the gas barrier layer, the degradation dueto oxygen and moisture can be reduced or suppressed without increasingthe thickness. Covering the light-emitting element with the insulatinglayer enables the surface of the insulating layer to be planarized.Therefore, the gas barrier layer formed on the upper side of theinsulating layer is also planarized, reducing or preventing thereduction in barrier that is otherwise degraded by strain due tounevenness.

The present invention may be provided such that the organic compoundconstituting the insulating layer is a polymer. For example, the polymeris made by curing or polymerizing monomers or precursors that werepreviously applied. Using monomers or precursors with low viscosityforms an excellently planarized polymer layer.

The present invention may also be provided such that the heat radiationlayer is formed of a metallic layer such as film-shaped gold, silver, orcopper.

Thereby, since the thermal conductivity in the gold, silver, and copperis large, the heat produced by light emitting of the light-emittingelement can be effectively radiated according to the present invention.By reducing the thickness of the heat radiation layer to 10 nm or less,for example, excellent light-transmissivity can be obtained, especiallyin the gold and silver. Therefore, when the light produced by thelight-emitting element is projected via the sealing layer so as toderive the light from a common electrode, the light can be transmittedwith only a small loss.

The present invention may also include forming a gas-permeableprotection film on the upper side of the sealing layer.

Thereby, according to the present invention, the scratching resistanceof the sealing layer, and by extension the scratching resistance of theelectro-optical apparatus, is enhanced, reducing or preventing damage tothe sealing layer and the light-emitting layer due to an externalimpact. Since the protection film is gas-permeable, the heat produced inthe sealing layer is liable to be radiated to the outside of theapparatus. The protection film may be formed on the entire surface ofthe substrate or may be patterned. In view of contaminant sticking,water absorption, moisture absorption, and abrasion resistance, theprotection film may preferably be a material with low surface-activeenergy, such as a fluorine polymer, silicone resin, polyolefine resin,and polycarbonate resin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a light-emitting element on a substratesealed with a sealing layer, in accordance with an embodiment of thepresent invention;

FIGS. 2(a)-2(c) are perspective views that show examples of anelectronic instrument having an organic EL apparatus, and include amobile phone, a watch-type electronic instrument, and a portableinformation processing apparatus, respectively.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Exemplary embodiments of an electro-optical apparatus, a manufacturingmethod thereof, and an electronic instrument according to the presentinvention are described below with reference to FIGS. 1 and 2.

The electro-optical apparatus according to the present invention isexemplified by an organic EL apparatus in this description.

An organic EL apparatus (electro-optical apparatus) 1 shown in FIG. 1includes a transparent substrate 2, a light-emitting element 3, and asealing layer 4 to hermetically seal the light-emitting element 3, whichare formed on the transparent substrate 2. The transparent substrate 2can be made of plastics, such as polyolefins, polyesters, polyacrylate,polycarbonate, polyethersulfone, and polyetherketone, and transparentmaterials, such as glass, for example. According to the exemplaryembodiment, glass is used.

The light-emitting element 3 substantially includes an anode 5 formed onthe transparent substrate 2, a hole-transporting layer 6, an insulatinglayer 7 formed so as to expose a surface of the anode 5 joining to thehole-transporting layer 6, an organic light-emitting layer 8, anelectron-transporting layer 9, and a cathode 10.

The anode 5 can be formed of elemental substances, such as aluminum(Al), gold (Au), silver (Ag), magnesium (Mg), nickel (Ni), zinc-vanadium(Zn—V), indium (In), and tin (Sn); a compound or mixture of theseelemental substances; and a conductive adhesive containing a metallicfiller, for example. According to the embodiment, ITO (indium tin oxide)is used. The anode 5 is preferably formed by sputtering, ion plating, orvacuum deposition. It may also be formed by printing with a spin coater,gravure coater, or knife coater; screen printing; or flexography. It ispreferable that the light transmittance of the anode 5 be set to be 80%or more.

The hole-transporting layer 6 may be formed by co-depositing a carbazolepolymer and a TPD (triphenyl compound) so as to have a film thickness inthe range of 10 nm to 1000 nm (100 nm to 700 nm, more preferably), forexample. As an alternative process, the hole-transporting layer 6 may beformed on the anode 5 by drying and heating treatments afterpositive-hole injecting and ejecting an ink composition containing atransporting material onto the anode 5 by an inkjet method, for example.A mixture of a polythiophenic derivative, such aspolyethylenedioxythiophene and polystyrenesulfonic acid, may be used asthe ink composition by dissolving it into a polar solvent, such asisopropyl alcohol.

The insulating film 7 may be patterned using a photolithographic and anetching technology after depositing SiO₂ on the entire surface of thesubstrate by a CVD method.

The organic light-emitting layer 8, as with the hole-transporting layer6, may be formed on the hole-transporting layer 6 by drying and heatingtreatments after ejecting an ink composition containing a light-emittinglayer material onto the hole-transporting layer 6 by an inkjet method.Light-emitting materials for use in the organic light-emitting layer 8may include a fluorenyl polymer derivative, a(poly)paraphenylenevinylene derivative, a polyphenylene derivative, apolyfluorene derivative, polyvinylcarbazole, a polythiophene derivative,perylene coloring matter, coumarin coloring matter, Rhodamine coloringmatter, other low-molecular-weight organic EL materials soluble in abenzene derivative, and a polymer organic EL material. In addition,suitable materials for the inkjet method include: aparaphenylenevinylene derivative, a polyphenylene derivative, apolyfluorene derivative, polyvinylcarbazole, and a polythiophenederivative, for example. Suitable materials for mask vacuum depositioninclude perylene coloring matter, coumarin coloring matter, andRhodamine coloring matter, for example.

Also, the electron-transporting layer 9 may be formed by evaporating anddepositing a metallic complex compound made from a metal and organicligand, which are preferably Alq3 (tris(8-quinolinolate)aluminumcomplex), Znq2 (bis(8-quinolinolate)zinc complex), Bebq2(bis(8-quinolinolate)berilium complex), Zn-BTZ(2-(o-hydroxyphenyl)benzothiazolezinc), and a perylene derivative so asto have a film thickness in the range of 10 nm to 1000 nm (100 nm to 700nm, more preferably).

The cathode 10 may be formed by a metal having a low work functioncapable of efficiently injecting electrons into theelectron-transporting layer 9, which preferably includes elementalsubstances, such as Ca, Au, Mg, Sn, In, Ag, Li, and Al; or alloys ofthese elemental substances, for example. According to the embodiment,the cathode 10 employs a double layer system of a cathode using mainlyCa and a reflection layer using mainly Al.

Although not shown, the organic EL apparatus according to the embodimentis of an active matrix type, in practice, in which a plurality of datalines and a plurality of scanning lines are arranged in a lattice, andto each of pixels that are defined by the data lines and the scanninglines and arrayed in a matrix arrangement, the light-emitting element 3is connected via a driving TFT such as a switching transistor and adriving transistor. When a driving signal is supplied via the data lineor scanning line, a current passes through between electrodes, so thatthe light-emitting element 3 emits light toward the outside of thetransparent substrate 2 so as to turn on the pixel. In addition, it isobvious that not only the active matrix type but also a passive drivingtype display may be incorporated into the present invention.

The sealing layer 4 is formed by sequentially depositing an insulatinglayer 11 covering the light-emitting element 3, a gas barrier layer 12,an insulating layer 13, and a heat radiation layer 14 on thelight-emitting element 3.

The insulating layers 11 and 13 are fabricated by an organic polymer.Specifically, as the insulating layers 11 and 13, polyacrylate,polymethacrylate, PET, polyethylene, or polypropylene; or thecombination of these polymers, may be used, for example.

The gas barrier layer 12 is made of an inorganic compound havinggas-barrier properties, such as an inorganic oxide, an inorganicnitride, and an inorganic carbide. Specifically, as the gas barrierlayer 12, indium oxide (In₂O₃), tin oxide (SnO₂), or the above-mentionedITO; or the combination of these compounds, may be used, for example.Silicon oxide (SiO₂), aluminum oxide (Al₂O₃), titanium oxide (TiO₃),aluminum nitride (AlN), silicon nitride (SiN), silicon carbide (SiC),silicon oxynitride (SiON), and diamond-like carbon (DLC); and thecombination of these compounds, can also be used.

The heat radiation layer 14 is made of a metallic film with a highcoefficient of thermal conductivity, such as gold (Au), silver (Ag), andcopper (Cu). The relationship between the thermal conductivity λ and theelectrical conductivity σ at the same temperature of the metal satisfiesthat λ/σ=constant according to the Wiedemann-Franz law. Therefore, for ametal having a high thermal conductivity, a metal having a highelectrical conductivity may be selected, so that the above-mentionedgold, silver, and copper may be selected. These metals include metalsthat are liable to be oxidized and that are very expensive, so an alloyof two or more of them or an alloy of them to which metallic elements,such as zinc, tin, and aluminum, can be added to the extent that doesnot change the thermal conductivity very much.

A manufacturing process of the sealing layer 4 structured as above(sealing-layer forming process) is described below. First, organicmonomer is applied by spray coating, etc., so as to cover thelight-emitting element 3, and then cured and polymerized to form theinsulating layer 11. Then, by vacuum deposition, low-temperaturesputtering, and CVD, the gas barrier layer 12 made of an inorganiccompound is formed on the insulating layer 11 (partly on the substrate2). Since the insulating layer 11 is formed as an active precursor bycuring the organic monomer applied, the top surface thereof (surface onwhich the gas barrier layer 12 is formed) is planarized. Therefore, thegas barrier layer 12 is also planarized following the insulating layer11. Then, the insulating layer 13 is formed by the same process as theinsulating layer 11.

Consecutively, the heat radiation layer 14 made of a metallic film isformed (film-formed) on the insulating layer 13 (partly on the gasbarrier layer 12). The heat radiation layer 14, as with the gas barrierlayer 12, is formed by vacuum deposition, low-temperature sputtering, orCVD. Since the insulating layer 13 is the organic polymer formed on theplanarized gas barrier layer 12, the top surface thereof is planarized,so that the heat radiation layer 14 formed on the insulating layer 13 isalso planarized. Although not shown, the heat radiation layer 14 isconnected to a heatsink so as to efficiently radiate the transmittedheat. In manufacturing the gas barrier layer 12 and the heat radiationlayer 14, the cost is reduced by using the same common mask.

In the organic EL apparatus 1 arranged as described above, thelight-emitting element 3 is sealed by the sealing layer 4 having the gasbarrier layer 12, so that degradation due to oxygen or moisture isreduced or suppressed. Also, the heat generated in the light-emittingelement 3 is transmitted to the heat radiation layer 14 and radiated viathe insulating layer 11, the gas barrier layer 12, and the insulatinglayer 13 (partly via the insulating layer 11 and the gas barrier layer12).

In such a manner, according to the embodiment, the factors ofdegradation of the light-emitting element 3 or an electrode, such asoxygen and moisture, are sealed with the film-shaped sealing layer 4,and the heat produced in the light-emitting element 3 is radiatedtherewith, so that the degradation of the light-emitting element 3 orthe electrode due to oxygen, moisture, and heat can be reduced orsuppressed without increasing the thickness, so that an organic ELapparatus 1 with a thin thickness and long life span can be provided.

According to the embodiment, since on the insulating layers 11 and 13made of an organic polymer, the gas barrier layer 12 and the heatradiating layer 14 are respectively formed, the gas barrier layer 12 andthe heat radiating layer 14 are planarized, preventing the reduction inbarrier in advance, which is otherwise degraded by strain due tounevenness.

Next, examples of electronic instruments having the organic EL apparatus1 according to the embodiment will be described.

FIG. 2(a) is a perspective view showing an example of a mobile phone. InFIG. 2(a), numeral 1000 denotes a mobile phone body, and numeral 1001denotes a display using the organic EL apparatus 1.

FIG. 2(b) is a perspective view showing an example of a watch-typeelectronic instrument. In FIG. 2(b), numeral 1100 denotes a watch body,and numeral 1101 denotes a display using the organic EL apparatus 1.

FIG. 2(c) is a perspective view showing an example of a portableinformation processing apparatus, such as a word processor and personalcomputer. In FIG. 2(c), numeral 1200 denotes the information processingapparatus, numeral 1202 denotes an input unit such as a keyboard,numeral 1204 denotes an information-processing apparatus body, andnumeral 1206 denotes a display using the organic EL apparatus 1.

The electronic instruments shown in FIGS. 2(a) to 2(c) include theorganic EL apparatuses 1 according to the embodiment, enabling anelectronic instrument having an organic EL display with a thin thicknessand long life span to be provided.

In addition, the technical scope of the present invention is not limitedto the embodiments described above, and various modifications may bemade within the spirit of the present invention.

For example, according to the embodiment, the insulating layer 13 isarranged between the gas barrier layer 12 and the heat radiation layer14. However, the insulating layer 13 is not necessarily needed, so thatthe heat radiation layer 14 may also be directly arranged on the gasbarrier layer 12. The positional arrangement between the gas barrierlayer 12 and the heat radiation layer 14 shown in the embodiment is anexample. Contrarily, the heat radiation layer 14 may be formed on theinsulating layer 11 while the gas barrier layer 12 may be formed on theinsulating layer 13. However, the arrangement that the heat radiationlayer 14 is exposed to the outside increases the surface area of theexposing atmosphere, if the heat radiation effect is considered, thearrangement shown in the embodiment is preferable.

Also, according to the embodiment described above, the heat radiationlayer 14 is formed of a metallic film. However, the invention is notlimited to this arrangement, and an insulating film protecting thetransmission of an alkaline metal may be adopted. The insulating filmmay be formed of a material including at least one element selected fromB (boron), C (carbon), and N (nitrogen) and at least one elementselected from Al (aluminum), Si (silicon), and P (phosphorus), and amaterial including Si, Al, N, O, and M (where M is at least one kind ofrare earth elements, and it is preferably at least one element selectedfrom Ce (cerium), Yb (ytterbium), Sm (samarium), Er (erbium), Y(yttrium), La (lanthanum), Gd (gadolinium), Dy (dysprosium), and Nd(neodymium)), for example. In this case, by arranging the insulatingfilm in the vicinity of the light-emitting element, the blocking effectagainst moisture and an alkaline metal can be obtained while thefunction of an insulating film also having a heat radiation effect canbe obtained, enabling the degradation of the light-emitting element tobe reduced or suppressed.

The insulating layer 11 is formed by applying an organic monomer so asto cover the light-emitting element 3, and curing it to be polymerized.It may be formed by polymerization after an organic monomer is applied.In addition, the specific materials shown in the embodiment are onlyexamples, so that appropriate alternation may be possible.

Furthermore, according to the embodiment, a type of apparatus that emitslight by the light-emitting element 3 which projects light to theoutside of the apparatus via the transparent substrate 2 is exemplified.Alternatively, a type of apparatus that emits light by thelight-emitting element 3 which projects light from the common electrodeopposite to the transparent substrate 2 via the sealing layer 4 may beapplicable. In this case, when the metallic film constituting the heatradiation layer 14 is gold or silver having high thermal conductivity,the heat is effectively radiated while high light-transmissivity(transparency) can be obtained using a gold film with a thickness of 10nm or less, enabling an organic EL apparatus with small loss oftransmitted light to be obtained.

As described in the embodiment, in an arrangement that the heatradiation layer 14 is exposed on the surface of the sealing layer 4,although it is advantageous in heat radiation, in order to enhanceabrasion resistance (scratching resistance), a protection film made of afilm or coated layer may be formed on the heat radiation layer 14 (i.e.,sealing layer 4). In this case, in view of contaminant sticking, waterabsorption, moisture absorption, and abrasion resistance, the protectionfilm may preferably be a material with low surface-active energy, suchas a fluorine polymer, silicone resin, polyolefine resin, andpolycarbonate resin. The protection film may also be formed on theentire surface of the substrate or may be patterned, and furthermore itmay preferably have high gas-permeability (1000 cm³/m²·24 hr, or more).Thereby, the heat transmitted to the heat radiation layer 14 can beradiated to the atmosphere via the protection film, enhancing aradiation effect.

In addition, according to the embodiment, only one layer of the gasbarrier layer 12 is arranged. The invention is not limited to thisarrangement and forming two layers or more enables the gas barrier to bemore enhanced. In this case, it is preferable that a plurality of units,each unit being constituted by a gas barrier layer and an organicpolymer layer (insulating layer), be laid up. Also, not only glass, butalso plastics, may be used as the substrate.

As described above, according to the present invention, anelectro-optical apparatus with a thin thickness and long life spanwithout reduction in gas barrier, and an electronic instrument having adisplay with the same capability, can be readily obtained. The presentinvention also enables an electro-optical apparatus with high heatradiation and abrasive resistance to be obtained, in which light isderived from the common electrode with only a small loss of thetransmitted light.

1. A light-emitting apparatus, comprising: a substrate; a light emittingelement formed on the substrate; and a sealing layer to seal thelight-emitting element, the sealing layer including a planarizing layerformed above the light-emitting element and at least a first layer and asecond layer formed above the planarizing layer, the first layer beingmade of an insulating film, the second layer being formed of a materialincluding at least one element selected from a group comprising boron,carbon, nitrogen, aluminum, silicon, phosphorus, oxygen, cerium,ytterbium, samarium, erbium, yttrium, lanthanum, gadolinium, dysprosium,neodymium, gold, silver and copper.
 2. The light-emitting apparatusaccording to claim 1, the first layer being formed on both of the topand side of the planarizing layer and extending to the substrate.
 3. Thelight-emitting apparatus according to claim 1, the second layer beingformed above the planarizing layer and extending to the first layer. 4.The light-emitting apparatus according to claim 1, the sealing layerfurther including an insulating layer between the first layer and thesecond layer.
 5. The light-emitting apparatus according to claim 1,further comprising a gas permeable protection film formed on the upperside of the sealing layer.